LD Bonder FDB211
- Name: LD Bonder FDB211
- Model: FDB211
- Brand: Shibuya Corporation
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Mô tả
Mô tả
- Name: LD Bonder FDB211
- Model: FDB211
- Brand: Shibuya Corporation
Product Information
This high-throughput and high-accuracy thermo-compression (TC) bonder is for optical module assembly such as laser diode bonding, sub-mount bonding and silicon photonics bonding.
Options are available for multiple chip bonding and other bonding methods.
FDB211 covers grip-ring supply.
Features
- High-accuracy bonding (3 σ = ±2µm)
- Capable of handling micro chips.
- The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
- The parametric sequence control enables programming control of the force, temperature and timings.
- The force feedback method achieves high-accuracy force control.
- A variety of optional settings, such as eutectic bonding, correspond to various bonding methods easily.
Options
- Tool head
- N2 purge
- Dispenser
- Paste transfer unit
- Multi-chips support
- Gel pack support
- Ultra-low bonding force head (min. 0.1 N)
Specifications
Size Guide
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